Lead-free tin solder paste Sn96.5Ag3Cu0.5 SAC305

What is Lead-free tin solder paste Sn96.5Ag3Cu0.5 SAC305?

Lead-free tin solder paste Sn96.5Ag3Cu0.5 is a type of solder paste used for electronics manufacturing, specifically for attaching electronic components to printed circuit boards (PCBs). It is a mixture of small particles of metal alloy (solder) suspended in a flux material. The solder powder sizes are available in many types, but the most commonly used ones are type 3 and type 4. And as it's a lead-free solder paste, so it's allowed to be used in many applications, because its RoHS compliant.

Lead-free tin solder paste Sn96.5Ag3Cu0.5

 

Compostions of Lead-free tin solder paste Sn96.5Ag3Cu0.5 SAC305:

The composition of this solder paste is 96.5% tin (Sn), 3% silver (Ag), and 0.5% copper (Cu). This combination of metals is known as SAC305, which is a commonly used lead-free solder alloy in the electronics industry. SAC305 solder paste offers good wetting and spreading properties, making it a reliable choice for many soldering applications.

 

The flux material used in the paste helps to clean the surface of the metals being soldered and prevent oxidation during the soldering process. The flux is typically a combination of organic and inorganic compounds that work together to remove oxides, reduce surface tension, and protect the metal surfaces from further oxidation.


Packing of Lead-free tin solder paste Sn96.5Ag3Cu0.5 SAC305: 

The lead-free tin solder paste Sn96.5Ag3Cu0.5 is typically stored in a jar, syringe or other type of applicator. It is applied to the solder pads on a PCB using a stencil or dispenser, and then the components are placed onto the pads. The assembly is then heated in a reflow oven, which melts the solder and creates a strong, permanent bond between the component and the PCB. For syringe package, each one is 100g or 200g; For package in jars, each one is 500g or 1kg.

tin solder paste Sn96.5Ag3Cu0.5 in syringetin solder paste Sn96.5Ag3Cu0.5 in jar

 

Overall, the lead-free tin solder paste Sn96.5Ag3Cu0.5 is a reliable and effective choice for electronics manufacturing, offering excellent properties for both the soldering process and the resulting connections. Its lead-free composition also makes it a more environmentally friendly option than traditional lead-based solder pastes.


If you need the solder paste SAC305, please contact us by email: xfsolder@gmail.com or xfsolder@163.com ; Whataspp / Wechat: 008613450770997


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