Name:Solder Paste 60/40 Sn60Pb40
Name:Tin Lead Solder Paste
Alloy:Tin Lead
Flux:No clean flux
Applications:Reflow soldering of electronics assembly
Country of Origin:China

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  • Solder Paste 60/40 Sn60Pb40

Product Description

Tin Lead Solder Paste 60/40 Sn60Pb40

Tin Lead Solder Paste 60/40 Sn60Pb40 is a paste that is mixed with a no clean flux with tin lead alloy powder 60/40. It consisted of 60% tin and 40% lead. 

Basic information of Tin Lead Solder Paste 60/40 Sn60Pb40:

Composition: Sn60Pb40, with 60% of tin & 40% of lead.

Powder size: Type 3, 25 to 45 microns. Other types of powder size can be made upon request.

Flux: No clean type (about 11.5%)

Melting Point: 183℃ to 190

Packing: Jar & Syringe.

Weight: 200g/jar, 500g/jar, 1000g/jar, 2000g/jar or other weight as per customers’ requirements.

Color & Appearance of Paste: Metallic grey paste form.

Solder paste 60/40 Sn60Pb40

Applications of Tin Lead Solder Paste 60/40 Sn60Pb40: 

Solder paste 60/40 is mainly used for SMT (surface mount technology) of PCB assembly, BGA etc. Solder paste is suitable for assembly of small electronic parts or soldering projects that manual soldering by solder wire or wave soldering by solder bar can’t achieve. Tin lead solder paste Sn60Pb40 is generally soldered through reflow soldering method.

tin lead solder paste 60/40 Sn60Pb40 reflow soldering 

Feature of Tin Lead Solder Paste 60/40 Sn60Pb40: 

1. Excellent wetting property. Solder paste 60/40 is fast melting & wetting easily.

2. No clean flux. The residue of tin lead solder paste Sn60Pb40 after soldering is non corrosive and transparent, in most general applications there is no need to do cleaning.

3. Stable viscosity during the continuous printing process. 

4. Bright & firm solder joints after soldering. 

Using & Storage of Tin Lead Solder Paste 60/40 Sn60Pb40:

1. Recommended storage of tin lead solder paste 60/40: kept in refrigerator at temperature between 0 to 10.

2. Solder paste Sn60Pb40 must be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the paste enough time to come to thermal equilibrium with the environment.

3. We recommend using out the solder paste 60/40 after the jar is open each time. Mix the solder paste gently for at least one minute after fresh jar is open. In case there’s still leftover paste after using, it must be tightly sealed and refrigerated when not in use. Before re-using, it’s a must to double check if the solder pastes hasn’t become separated or thicken to its usual state.

4. Read and follow TDS of solder paste Sn60Pb40 before using.

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