Product Description

Tin Lead Solder Paste 55/45 Sn55Pb45

Tin Lead Solder Paste 55/45 Sn55Pb45 is a creamy paste that is mixed with a no clean flux with tin lead alloy powder 55/45. It consisted of 55% tin and 45% lead.

Basic information of Tin Lead Solder Paste 55/45 Sn55Pb45:

Composition: Sn55Pb45, with 55% of tin & 45% of lead.

Powder size: Type 3, 25 to 45 microns. Other size of powder is available upon request.

Flux: No clean type (about 11.5%)

Melting Point: 183℃ to 203℃

Packing: Jar or Syringe.

Weight: 200g/jar, 500g/jar, 1000g/jar, 2000g/jar or other weight as per customers’ requirements.

Color & Appearance of Paste: Metallic grey paste form.

Applications of Tin Lead Solder Paste 55/45 Sn55Pb45: 

Solder paste 55/45 is mainly used for SMT (surface mount technology) of PCB assembly, BGA etc. Solder paste is suitable for assembly of small electronic parts or soldering projects that manual soldering by solder wire or wave soldering by solder bar can’t achieve. Tin lead solder paste Sn55Pb45 is generally soldered through reflow soldering method.

Feature of Tin Lead Solder Paste 55/45 Sn55Pb45: 

1. Excellent wetting property. Solder paste 55/45 is fast melting & wetting easily.

2. No clean flux. The residue of tin lead solder paste Sn55Pb45 after soldering is non corrosive and transparent, in most general applications there is no need to do cleaning.

3. Stable viscosity during the continuous printing process. 

4. Bright & firm solder joints after soldering. 

5. Reasonable price and lower cost than lead free solder paste.

Using & Storage of Tin Lead Solder Paste 55/45 Sn55Pb45:

1. Recommended storage of tin lead solder paste 55/45: kept in refrigerator at temperature between 0 to 10℃.

2. Solder paste Sn55Pb45 must be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the paste enough time to come to thermal equilibrium with the environment.

3. We recommend using out the solder paste 55/45 after the jar is open each time. Mix the solder paste gently for at least one minute after fresh jar is open. In case there’s still leftover paste after using, it must be tightly sealed and refrigerated when not in use. Before re-using, it’s a must to double check if the solder pastes hasn’t become separated or thicken to its usual state.

4. Read and follow TDS of solder paste Sn55Pb45 before using.