Low Temperature Lead Free T3 Sn42Bi58 Tin Bismuth Solder Paste for PCB SMT Reflow Soldering

Low Temperature Lead Free T3 Sn42Bi58 Tin Bismuth Solder Paste for PCB SMT Reflow Soldering

Lead free T3 Sn42Bi58 tin bismuth solder paste is a popular choice for use in PCB and SMT soldering due to its strong bonding properties and low melting point. This type of solder paste is made from a mixture of tin bismuth powder, flux and other trace elements that are formulated to provide a strong and reliable bond at low temperatures. The tin bismuth powder sizes are available from T1 to T7, while most commonly used types are T3 solder paste or T4 solder paste. Powder size of T3 solder paste is from 25 to 45 microns, and powder size for T4 is 20 to 38 microns.

 

It is a lead free solder paste is a type of solder paste that does not contain any lead, making it a more environmentally friendly and safe choice for use in electronics manufacturing. And low temperature of melting point at 138, making this solder paste a good choice for use in soldering applications where the temperature may be restricted or limited.

 

Thus, in our PCB and SMT soldering we should choose the proper type of tin solder paste to create a strong bonding properties and proper working temperature. Tin solder paste is available in a variety of formulations to meet the specific needs and preferences of the user.

 

To use PCB solder paste we need to use SMT (surface mount technology) to print the sn42bi58 solder paste on our PCB boards, by using a stencil. And for small jobs, using hot air guns to conduct the soldering process is good enough. While to achieve a more productive volume of PCB soldering, reflow soldering is a better way. Reflow soldering is a process in which the solder paste is applied to the PCB or SMT components, and then the PCB or components are heated to a proper temperature to melt the solder paste and create a strong and reliable bond. It’s important to follow up the reflowing chart provided by the reflow paste manufacturer, so that the smt tin solder paste can melt and solidify properly to bond between the PCB and the electronic components, ensuring a stable and reliable connection.

Sn42Bi58 Solder Paste

 

Benefits of Low Temperature Lead Free T3 Sn42Bi58 Tin Bismuth Solder Paste for PCB SMT Reflow Soldering

Sn42Bi58 tin bismuth solder paste is its ability to provide a strong and reliable bond at low temperatures. This is particularly useful in soldering applications where the temperature may be restricted or limited, as it allows for a strong and reliable bond to be formed without the need for high heat. Some electronic components are temperature sensitive and easily to be damaged by high temperature. Such a pcb paste can help to reduce the risk of damaging the electronic components or the PCB during the soldering process.

 

This type of T3 tin solder paste is with good fluidity but with good viscosity. It is easy to work with and can be easily applied to the PCB or SMT components during stencil printing. It is no clean type bismuth solder paste, and requires no cleaning after soldering because there’s just little, non-aggressive residue. Even in special cases, that you prefer to clean the PCB after soldering, it is easy to clean up, as it can be easily removed with a simple wiping action.

Sn42Bi58 solder paste is a lead free solder paste. In some countries, leaded materials are not allowed to be used in electronics. And in this case, during the EMS (electronics manufacturing), we must use the lead free solder paste rather than leaded solder paste.

 

SMT tin solder paste meets the trend of electronics manicuring development. Nowadays electronic products are designed to be smaller and smaller, by using solder wire it’s very difficult to operate on the PCB or electronic components. Thus, SMT manufacturing is introduced into the electronics manufacturing, and tin solder made in a paste form can meet such soldering work. T3 solder paste, its powder size can meet most general PCB printing and soldering work.

solder paste printing

 

What should we pay attention to when using low temperature lead free T3 Sn42Bi58 tin bismuth solder paste for PCB or SMT soldering?

It is important to follow the proper reflow chart and process to ensure a strong and reliable bond. The reflow chart and process will vary depending on the specific type of solder paste being used, as well as the specific soldering application. However, generally speaking, the following steps can be followed when using low temperature lead free T3 Sn42Bi58 tin bismuth solder paste for PCB or SMT soldering:

Preheat the PCB or SMT components: Before applying the tin solder paste, it is important to preheat the PCB or components to a temperature that is slightly below the melting point of the Sn42Bi58 solder paste. This will help to ensure that the paste is able to flow smoothly and form a strong and reliable bond.

Apply PCB solder paste: Once the PCB or components have been preheated, the bismuth solder paste can be applied using stencil printing. It is important to carefully apply the paste in a thin, even layer, ensuring that it covers all of the areas that need to be soldered.

Place the SMT components: After the SMT tin solder paste has been applied, the SMT components can be placed onto the PCB. It is important to carefully align the components and ensure that they are properly seated on the PCB.

Reflow the solder paste: Once the SMT components are in place, the PCB or components can be heated to a temperature that is slightly above the melting point of this lead free solder paste. This will cause the paste to flow and form a strong and reliable bond between the components and the PCB.

Cool and inspect: After the reflow process is complete, the PCB or components should be allowed to cool to room temperature. Once cooled, the bond between the components and the PCB can be inspected to ensure that it is strong and reliable.

Reflow chart of low temperture solder paste sn42bi58

 

Overall, low temperature lead free T3 Sn42Bi58 tin bismuth solder paste is a popular choice for use in PCB and SMT soldering due to its strong bonding properties and low melting point, easy to clean up , easy to work with, environmentally friendly solder paste.


Contact our sales team, if you need to purchase this T3 Sn42Bi58 Solder Paste. Email: xfsolder@gmail.com or xfsolder@163.com ; Whatsapp / Wechat: 0086 13450770997 

 

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