Sn63Pb37 IC Reballing Solder Paste

Sn63Pb37 IC Reballing Solder Paste: Everything You Need to Know

In the world of electronics, the process of reballing has become increasingly important. This process involves removing the existing solder balls from a component and replacing them with new ones. One of the most critical components of this process is the solder paste used. Sn63Pb37 IC reballing solder paste is one of the most popular choices for this process. In this article, we will explore what this solder paste is, what IC reballing is, the features of IC reballing paste, and how to use it.

sn63pb37 ic reballing solder paste 

What is Sn63Pb37 Solder Paste?

Sn63Pb37 solder paste is a type of lead-based solder paste that is commonly used in electronics manufacturing. It is a eutectic alloy, which means it has a specific melting point and solidifies at a specific temperature. This solder paste is made up of 63% tin and 37% lead. It is a popular choice for reballing because it has excellent wetting properties, which means it can easily flow onto the surface of the component being soldered.

What is IC Reballing?

IC reballing is the process of removing the existing solder balls from a component and replacing them with new ones. This process is necessary when a component needs to be repaired or reworked. IC reballing is a delicate process that requires precision and skill. It involves removing the old solder balls, cleaning the component, applying new solder paste, and reflowing the component.

ic reballing solder paste


Features of IC Reballing Paste

IC reballing paste is specifically designed for the reballing process. It has several features that make it an ideal choice for this process. These features include:

1. Good wetting properties: IC reballing paste has excellent wetting properties, which means it can easily flow onto the surface of the component being soldered.

2. Low oxide formation: IC reballing paste has low oxide formation, which means it can easily bond with the component being soldered.

3. Good reflow properties: IC reballing paste has good reflow properties, which means it can easily melt and solidify at the correct temperature.

4. Consistent particle size: IC reballing paste has a consistent particle size, which means it can be applied evenly and consistently.

How to Use Sn63Pb37 IC Reballing Paste?

Using Sn63Pb37 IC reballing paste requires precision and skill. Here are the steps involved in using IC reballing paste:

1. Remove the old solder balls from the component using a reballing station.

2. Clean the component using a flux remover and a cleaning brush.

3. Apply IC reballing paste to the component using a stencil.

4. Place the new solder balls onto the component using a reballing station.

5. Reflow the component using a reflow oven.

Conclusion

Sn63Pb37 IC reballing solder paste is an excellent choice for the reballing process. It has several features that make it an ideal choice for this process, including good wetting properties, low oxide formation, good reflow properties, and consistent particle size. Using IC reballing paste requires precision and skill, but with the right tools and techniques, it can be done successfully. If you are looking for a reliable and effective solder paste for your reballing needs, Sn63Pb37 IC reballing solder paste is an excellent choice.


If you need to buy Sn63Pb37 IC Reballing Solder Paste, please contact our sales team, Email: xfsolder@gmail.com or xfsolder@163.com ; Whatsapp/Wechat: 008613450770997


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