SMT Tin Solder Paste Sn63Pb37 63 37

SMT Tin Solder Paste Sn63Pb37 63 37 

 tin solder paste 63 37

General introduction of SMT Tin Solder Paste Sn63Pb37 63 37:

Tin solder paste is called tin paste. It's a mixture of tin powder mixed with flux, shown in a pasty form. Tin paste is available in many different compositions and we classified them basing on the metal contents. The tin solder paste Sn63Pb37 is consisted of tin powder alloy of 63% tin & 37% lead. The tin powder alloy are tiny, generally in XF Solder paste we use powder size Type 3, the diameter of tin powder is 20 to 45um. Tin paste is used mainly for SMT soldering (surface mount technology), we applied the SMT solder paste by using stencil to print it on to the electronics componets.

 

Why do we use SMT Tin Solder Paste Sn63Pb37 63 37?

Tin paste is invented in order to make assembly of small IC or PCB possible. Traditionally we use solder wire for THT soldering or Solder bar for wave soldering for EMS (electronics manufacturing). But developments of electronic products are becoming smaller and smaller, that requires the ICs or PCBs to be smaller or tiny too. In such cases, solder wire or solder bar can't fulfill such tiny & accurate soldering. That's why tin solder paste is invented and used, for these SMT soldering projects. While tin solder paste 63 37 is comparative low melting point and it's eutectic alloy, melting point is only 183℃, quite easy to use (fast melting and fast solidifying).

 SMT Solder paste

More details of SMT Tin Solder Paste Sn63Pb37 63 37:

Tin solder paste looks like greese because it contains about 11% of flux when measuring by weight. The function of the flux inside tin paste are: one hand is to activate the tin alloys so that it can melt well and form nice solder bead; on the other hand it provides the viscosity of the tin paste so that it can be well kept on the PCB until its heated & soldered. 

 

What eventually remains on the PCB or ICs are the tin alloys after the SMT soldering. The tin powder alloy inside the tin solder paste Sn63Pb37 (tin passte 63/37) is molten under the heat and activaction of flux, so it well combines the electronics components together.

 

We produce the SMT solder paste in jar of 500g, and also other weight like 200g/jar or 1000g/jar etc. Cold storage of solder paste 63 37 is recommonded in order to keep the tin paste have a longer shelf life. With proper storage, tin solder paste and be kept for 6 months without affecting its performance.

 

If you are looking to import SMT Tin Solder Paste Sn63Pb37 63 37 from China, please contact our sales team:

Email: xfsolder@gmail.com or xfsolder@163.com

Whatsapp/Wechat: 008613450770997

tin solder paste manufacturing 

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