Name:Tin Lead Solder Bar
Product Type:Tin Lead Solder Bar
Place of Origin:Foshan, China
Composition:Tin, Lead
Percentage of Tin:From 12 to 63
Percentage of Lead:From 35 to 86
Diemension:31.5cm1.5cm1.0cm, around 500g/PC
Packing:48PCS/box
Application:Lighting, LED, PCB, Precise instruments, Electronic components, Audio and Sound system and so on

  • Tin Lead Solder Bar

Product Description

Tin Lead Solder Bar:

We produce and export Tin Lead Solder Bar with a variety of alloy composition for customer choice. 

Contact our sales team at: xfsolder@gmail.com or xfsolder@163.com or WhatsApp / Wechat: 008613450770997 for more information.

Tin Lead Solder Bar Type of Alloy:

Specification

Melting point

Working temperature

Density (g/cm3)

Main application

 Sn63 / Pb37

183

240-250

11.06

High antioxidant series suitable for wave soldering, widely use in electronics industry, telecommunications, aviation and other welding products.

 Sn60 / Pb40

183-190

250-260

10.75

 Sn55 / Pb45

183-203

260-280

10.7

 Sn50 / Pb50

183-215

280-300

10.21

High antioxidant series suitable for household welding, widely used in electric products, instrument and so on.

 Sn45 / Pb55

183-227

280-320

9.96

 Sn40 / Pb60

183-238

290-330

9.72

 Sn35 / Pb65

183-248

300-350

9.5

Normal antioxidant series widely used in electronic and machinery, machine, automobile water tank, lamp bulb, cable joint and so on.

 Sn30 / Pb70

183-258

320-350

9.28

 Sn25 / Pb75

183-266

320-350

9.07

 Sn20 / Pb80

183-279

320-350

8.87

 Sn15 / Pb85

227-288

320-350

8.68

 Sn10 / Pb90

268-301

320-350

8.5

 Sn5 / Pb95

300-311

360-400

8.4

Size of Tin Lead Solder Bar:

31.5cm * 1.5cm * 1.0cm


Weight of Tin Lead Solder Bar:

500g/PC (Total: 25kg/box, 48PCS/box)

 

Features of Tin Lead Free Solder Bar:

1. Eutectic alloy.

2. Bridge-free and icicle-free soldering.

3. Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.

4. Good through-hole penetration.

5. Good topside fillet formation.

6. Dross rate equal or lower than tin-lead solder.

7. Does not require a nitrogen atmosphere.

8. Does not erode copper from holes, pads and tracks.

9. Low rate of copper leaching makes it easy to control the copper content of the solder bath.

10. Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.

11. Thermal fatigue resistance and creep strength better than tin-lead.

12. Slow, even growth of the intermetallic layer at the solder/substrate interface.

13. Also performs well in selective and dip soldering.


Packing:

Solder bar is packaged with carton 

Neutral packing or OEM packing is available

lead free solder bar packing

Lead time: 

We have a lot of stock of Tin Lead Free Solder Bar, if order quantity is not very big, we can send the goods right after receive payment. If order quantity is big, then delivery time is 10days after deposit received. 

Shipping term: 

Small order of tin lead solder bar, will be sent by courier (DHL, FEDEX, TNT and so on). For bigger order quantity, we suggest to ship them by air or by sea. We are near Foshan, Rongqi Port / Guangzhou Port.


Spectrum Analyzer:

Technical support to help customers to analyse their samples, and send out report. 


Hits: 【Print】 

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