Name:Tin Lead Solder Bar
Product Type:Tin Lead Solder Bar
Place of Origin:Foshan, China
Composition:Tin, Lead
Percentage of Tin:From 12 to 63
Percentage of Lead:From 35 to 86
Diemension:31.5cm1.5cm1.0cm, around 500g/PC
Packing:48PCS/box
Application:Lighting, LED, PCB, Precise instruments, Electronic components, Audio and Sound system and so on

  • Tin Lead Solder Bar

Product Description


Tin Lead Solder Bar:

We are manufacturer and exporter of Tin Lead Solder Bar with a variety of alloy composition for customer choice.

 

We accept both big orders and small orders. Big order will be delivered by sea, small orders will be sent by courier service.

Contact our sales team at: xfsolder@gmail.com or xfsolder@163.com, WhatsApp or Wechat: 008613450770997, or fill in the Contact Form in the bottom of this page.


Tin Lead Solder Bar Type of Alloy:

Alloy
Melting point
Working temperature
 Sn63 / Pb37 183 240-250℃
 Sn60 / Pb40 183-190 250-260℃
 Sn55 / Pb45 183-203 260-280℃
 Sn50 / Pb50 183-215 280-300℃
 Sn45 / Pb55 183-227 280-320℃
 Sn40 / Pb60 183-238 290-330℃
 Sn35 / Pb65 183-248 300-350℃
 Sn30 / Pb70 183-258 320-350℃
 Sn25 / Pb75 183-266 320-350℃
 Sn20 / Pb80 183-279 320-350℃
 Sn15 / Pb85 227-288 320-350℃
 Sn10 / Pb90 268-301 320-350℃
 Sn5 / Pb95 300-311 360-400℃

Basic information of Tin Lead Solder Bar:

Size: 29.5cm * 1.5cm * 1.0cm

Color: Silvery

tin lead solder bar

Applications of Tin Lead Solder Bar:

1. For dip soldering or wave soldering of electronic products, such as PCBA

2. Assembly of Copper roofing, flashing etc

3. Assembly of stained glass.

4. Other tinning purpose.

solder bar application

 

Features of Tin Lead Free Solder Bar:

1. Eutectic alloy.

2. Bridge-free and icicle-free soldering.

3. Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.

4. Good through-hole penetration.

5. Good topside fillet formation.

6. Dross rate equal or lower than tin-lead solder.

7. Does not require a nitrogen atmosphere.

8. Does not erode copper from holes, pads and tracks.

9. Low rate of copper leaching makes it easy to control the copper content of the solder bath.

10. Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.

11. Thermal fatigue resistance and creep strength better than tin-lead.

12. Slow, even growth of the intermetallic layer at the solder/substrate interface.

13. Also performs well in selective and dip soldering.

features of solder bar

Packing:

Solder bar is packaged with carton 

Neutral packing or OEM packing is available

solder bar packing

solder bar packing 2

solder bar pallet

Lead time: 

We have a lot of stock of Tin Lead Free Solder Bar, if order quantity is not very big, we can send the goods right after receive payment. If order quantity is big, then delivery time is 10days after deposit received. 

Shipping term: 

Small order of tin lead solder bar, will be sent by courier (DHL, FEDEX, TNT and so on). For bigger order quantity, we suggest to ship them by air or by sea. We are near Foshan, Rongqi Port / Guangzhou Port.

Hits: 【Print】 

Contact Form

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