| Name: | Tin Lead Solder Bar |
| Product Type: | Tin Lead Solder Bar |
| Place of Origin: | Foshan, China |
| Composition: | Tin, Lead |
| Percentage of Tin: | From 12 to 63 |
| Percentage of Lead: | From 35 to 86 |
| Diemension: | 31.5cm1.5cm1.0cm, around 500g/PC |
| Packing: | 48PCS/box |
| Application: | Lighting, LED, PCB, Precise instruments, Electronic components, Audio and Sound system and so on |
Product Description
Tin Lead Solder Bar:
We are manufacturer and exporter of Tin Lead Solder Bar with a variety of alloy composition for customer choice.
We accept both big orders and small orders. Big order will be delivered by sea, small orders will be sent by courier service.
Contact our sales team at: xfsolder@gmail.com or xfsolder@163.com, WhatsApp or Wechat: 008613450770997, or fill in the Contact Form in the bottom of this page.
Tin Lead Solder Bar Type of Alloy:
| Alloy | Melting point
℃
|
Working temperature ℃ |
| Sn63 / Pb37 | 183 | 240-250℃ |
| Sn60 / Pb40 | 183-190 | 250-260℃ |
| Sn55 / Pb45 | 183-203 | 260-280℃ |
| Sn50 / Pb50 | 183-215 | 280-300℃ |
| Sn45 / Pb55 | 183-227 | 280-320℃ |
| Sn40 / Pb60 | 183-238 | 290-330℃ |
| Sn35 / Pb65 | 183-248 | 300-350℃ |
| Sn30 / Pb70 | 183-258 | 320-350℃ |
| Sn25 / Pb75 | 183-266 | 320-350℃ |
| Sn20 / Pb80 | 183-279 | 320-350℃ |
| Sn15 / Pb85 | 227-288 | 320-350℃ |
| Sn10 / Pb90 | 268-301 | 320-350℃ |
| Sn5 / Pb95 | 300-311 | 360-400℃ |
Basic information of Tin Lead Solder Bar:
Size: 29.5cm * 1.5cm * 1.0cm
Color: Silvery
Applications of Tin Lead Solder Bar:
1. For dip soldering or wave soldering of electronic products, such as PCBA
2. Assembly of Copper roofing, flashing etc
3. Assembly of stained glass.
4. Other tinning purpose.
Features of Tin Lead Free Solder Bar:
1. Eutectic alloy.
2. Bridge-free and icicle-free soldering.
3. Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
4. Good through-hole penetration.
5. Good topside fillet formation.
6. Dross rate equal or lower than tin-lead solder.
7. Does not require a nitrogen atmosphere.
8. Does not erode copper from holes, pads and tracks.
9. Low rate of copper leaching makes it easy to control the copper content of the solder bath.
10. Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
11. Thermal fatigue resistance and creep strength better than tin-lead.
12. Slow, even growth of the intermetallic layer at the solder/substrate interface.
13. Also performs well in selective and dip soldering.
Packing:
Solder bar is packaged with carton
Neutral packing or OEM packing is available
Lead time:
We have a lot of stock of Tin Lead Free Solder Bar, if order quantity is not very big, we can send the goods right after receive payment. If order quantity is big, then delivery time is 10days after deposit received.Shipping term:
Small order of tin lead solder bar, will be sent by courier (DHL, FEDEX, TNT and so on). For bigger order quantity, we suggest to ship them by air or by sea. We are near Foshan, Rongqi Port / Guangzhou Port.
